PCB Capabilities

Below is an in-depth list of Fineline Global’s PCB capabilities. This table will allow you to better understand our capabilities in order the desired outcome is realised.

Feature

Standard

Advanced

R&D

Layers count

16

40

60

Minimum board thickness ( with solder mask)

0.6mm

0.40mm

0.20mm

Maximum board thickness

4mm

6mm

10mm

Minimum board size

50mm x 50mm

30mm x 30mm

5mm x 5mm

Maximum board size

600mm x 570mm

960mm 600mm

1250mm x 570mm

Minimum line/space innerlayer (depend on copper weight)

3mil/3mil

2.5mil/2.5mil

2mill/2mil

Minimum line/space outerlayer (depend on copper weight)

4mil/4mil

3mil/3mil

2mil/2mil

Surface finish types

OSP, HASL, ENIG,

Immersion Silver, Immersion Tin,

Hard gold (Connector board)

Plus hard gold (Selective board) soft gold, ENEPIG

Plus ISIG,EPIG

Mechanical hole size ( Finish hole size)

0,2 mm

0,15 mm

0,1 mm

Maximum aspect ratio PTH

10

16

20

Finished tolerance PTH

+/-0,075 mm

+/-0,05 mm

+/-0,025 mm

Finished tolerance NPTH

+/-0,05 mm

+/-0,025 mm

+/-0,015

Epoxy filled through holes (Y/N)

Yes

Yes

Yes

Capped via (Y/N)

Yes

Yes

Yes

Maximum copper weight outerlayer

3oz

12oz

>12oz

Maximum copper weight innerlayer

3oz

12oz

>12oz

Control depth drill (Y/N)

Yes

Yes

Yes

Tolerance depth drill

+/-0,1 mm

+/-0,075 mm

+/-0,05 mm

Backdrill diameter

0,50 mm

0,35 mm

0,25 mm

Min. depth of backdrill

0,25 mm

0,20 mm

0,15 mm

Drill depth tolerance

+/-0,15 mm

+/- 0,10 mm

<0,10 mm

HDI type 1+n+1

Yes

Yes

Yes

HDI type 2+n+2

Yes

Yes

Yes

HDI type 3+n+3

Yes

Yes

Yes

HDI type 4+n+4

NA

Yes

Yes

Any layer

No

Yes

Yes

Min. laser hole diameter

0.075

0.065

Only by request

Microvia Max.aspect ratio

1:1

1:1

1:1

Copper filled microvia

Yes

Yes

Yes

Resin filled microvia

Yes

Yes

Yes

Stacked &Staggered via.

Yes

Yes

Yes

Laser via land pad size

Via diameter+0.15 mm

Via diameter+0.125 mm

Via diameter+0.1 mm

Laser via capture pad size

Via diameter+0.25 mm

Via diameter+0.225 mm

Via diameter+0.2 mm

Rigid-flex boards (Y/N)

Yes

Yes

Yes

Min. width between rigid parts

5 mm

3mm

2mm

Min. Flex width

5mm

3mm

2mm

Flex boards (Y/N)

Yes

Yes

Yes

IMS boards

Yes

Yes

Yes

Embedded components (Y/N)

No

Yes

Yes

Soldermask via plugging IPC4761 type VI (Y/N)

Yes

Yes

Yes

Epoxy via plugging IPC4761 type VI(Y/N)

Yes

Yes

Yes

Download our Capabilities brochure